L830-1J1T-43 Low-Profile RJ45 Jack Conn Magjack 1Port 1000 Base-T
Shielded
Quick Details
Low-Profile 1000 Base-T Shielded
1. RoHS “NL” peak solder rating 260°C
2. Low height and small footprint to minimize board space
3. Meets IEEE 802.3 specification
4. 350µH minimum OCL with 8mA bias current
5. High performance for maximum EMI suppression
6. Designing Model: 【L830-1J1T-43】
7. Mass Production Model:【LPJK7036A98NL】
MAG.REVERSE LATCH,
LED optional; EMI-finger Optional.
Description
L830-1J1T-43 Low-Profile RJ45 Jack Conn Magjack 1Port 1000 Base-T
Shielded
| Single Port Low Profile Ethernet RJ45 Connector with 1000 Base-T
Integrated Magnetics, Orange&Green/Yellow, Tab Up, RoHS |
| LINK-PP Part Number | LPJK7036A98NL |
| Belfuse Part Number | L830-1J1T-43 |
| Application-Lan | ETHERNET(NoN PoE) |
| Contact Mating Area Plating | GOLD 6u"/15u"/30u" |
| Cores per Port | 8 |
| Diodes | NO DIODES |
| LED Option | ORANGE&GREEN/YELLOW |
| Latch | TAB UP |
| Number of Ports | 1X1 |
| PCB | FR4 |
| PCB Mount Angle | SIDE ENTRY |
| PCB Retaining Post | T POST |
| Package Height (mm) | 11.30 |
| Package Length (mm) | 24.04 |
| Package Width (mm) | 17.78 |
| Pin Type | THT SOLDER |
| RoHS Compliant | YES-RoHS-5 WITH LEAD IN SOLDER EXEMPTION |
| Search | YES |
| Shield EMI Tabs | WITH |
| Speed | 1000 BASE-T |
| Temperature | 0 TO 70℃ |
| Turns Ratio RX | 1CT:1CT |
| Turns Ratio TX | 1CT:1CT |
Applications For Terminal Users
Designed to support applications, such as ADSL modems, and
LAN-on-Motherboard. Networking and communication equipment such as HUB, PC card, Switch,
Router, PC Mainboard, SDH, PDH, IP Phone, xDSL modem, Call Center solutions, Complex set-top boxes, VOIP gateways setup,
Border Gateway Protocol, fast ethernet switch ...
Competitive Advantage
18 years of production experience,
2600 staff,
100% test
Flexible delivery time
Main Customer
Design for Ti, Intel, Samsung, Fluke, Jabil, Flextronics, Cypress,
Freescale, EKF.......
EMS Application
Built-in Flexible PCB Assembly; Rigid-Flexible PCB Assembly;
Microelectronic, Flip Chip; Microelectronic, Chip On Board;
Optoelectronic Assembly; RF / Wireless Assembly; Through Hole
Assembly; Surface Mount Assembly; System Assembly; Printed Circuit
Board Assembly
