5631-S-K6-F-8C RJ45 Modular Jack Shielded With EMI-Finger
LPJE101CNL
Shielded 1x1 Port 8P8C RJ45 Female Connector without Integrated
Magnetics |
LINK-PP Part Number | LPJE101CNL |
Other Part Number | 5631-S-K6-F-8C |
Application-Lan | ETHERNET(NoN PoE) |
AutomDX | YES |
Bst Circuit | YES |
Configuration RX | T,C |
Configuration TX | T,C |
Contact Mating Area Plating | GOLD 6u"/15u"/30u" |
Cores per Port | - |
Diodes | NO DIODES |
LED Option | Without LEDs |
Latch | TAB UP |
Number of Ports | 1X1 |
PCB | FR4 |
PCB Mount Angle | SIDE ENTRY |
PCB Retaining Post | T POST |
Package Height (Inches) | 0.516 |
Package Height (mm) | 13.10 |
Package Length (Inches) | 0.620 |
Package Length (mm) | 15.75 |
Package Width (Inches) | 0.640 |
Package Width (mm) | 16.25 |
Pin Type | THT SOLDER |
RoHS Compliant | YES-RoHS-5 WITH LEAD IN SOLDER EXEMPTION |
Search | YES |
Shield EMI Tabs | With |
Speed | RJ45 without Magnetics |
Temperature | -40 TO + 85℃ |
Turns Ratio RX | 1CT:1CT |
Turns Ratio TX | 1CT:1CT |
RJ45 Connector Datasheet:
TECHNICAL CHARACTERISTICS
INSULATOR: PBT
FLAMMABILITY RATING: UL94-V0
COLOR: BLACK
CONTACT MATERIAL: PHOSPHOR BRONZE
CONTACT TYPE: STAMPED
CONTACT PLATING: GOLD
SHIELDING: BRONZE NI PLATED
QUALITY CLASS: 500 MATING CYCLES
ENVIRONMENTAL
OPERATING TEMPERATURE: -40 TO 85°C
COMPLIANCE: LEAD-FREE AND ROHS
ELECTRICAL
CURRENT RATING: 1.5A
WORKING VOLTAGE: 120VAC
INSULATOR RESISTANCE: >1000 MΩ
DIELECTRIC WITHSTANDING VOLTAGE: 1000 VAC/MIN
CONTACT RESISTANCE: 20 mΩ MAX
STANDARD
CERTIFIED: E324776
SOLDERING:
JEDEC LEAD-FREE WAVE SOLDERING PROCESS
PACKAGING: TRAY
Applications For Terminal Users
Designed to support applications, such as ADSL modems, and
LAN-on-Motherboard. Networking and communication equipment such as HUB, PC card, Switch,
Router, PC Mainboard, SDH, PDH, IP Phone, xDSL modem, Call Center solutions, Complex set-top boxes, VOIP gateways setup,
Border Gateway Protocol, fast ethernet switch ...
EMS Application
Built-in Flexible PCB Assembly; Rigid-Flexible PCB Assembly;
Microelectronic, Flip Chip; Microelectronic, Chip On Board;
Optoelectronic Assembly; RF / Wireless Assembly; Through Hole
Assembly; Surface Mount Assembly; System Assembly; Printed Circuit
Board Assembly
