ARJM11C7-805-NN-CW2 Extended 8P8C RJ45 Modular Jack AutoMDIX
2.5GMbps
- Cross Equivalent to ARJM11C7-805-NN-CW2 Abracon Jack
- Rj45 2.5G Base-T Ethernet Filtered Jack Without LED Indicators
- Rj45 With Integrated Magnetics Industry standard
- Fully IEEE803.2 Compliant over entire temperature range 0°C to 70°C
| Part Status | Active | |
|---|
| Connector Type | RJ45 | |
|---|
| Number of Ports | 1 | |
|---|
| Number of Rows | 1 | |
|---|
| Applications | 2.5G Base-T, AutoMDIX | |
|---|
| Mounting Type | Through Hole | |
|---|
| Orientation | 90° Angle (Right) | |
|---|
| Termination | Solder | |
|---|
| Height Above Board | 0.543" (13.80mm) | |
|---|
| LED Color | Does Not Contain LED | |
|---|
| Number of Cores per Jack | 8 | |
|---|
| Shielding | Shielded, EMI Finger | |
|---|
| Features | Board Lock | |
|---|
| Tab Direction | Up | |
|---|
| Contact Material | - | |
|---|
| Contact Finish | Gold | |
|---|
| Operating Temperature | 0°C ~ 70°C | |
|---|
| Contact Finish Thickness | 6.00µin (0.152µm) |
|---|
Why Choose Us
World’s Leader Supplier Of Integrated RJ45 Connector And Discrete
Magnetic Transformers
100% Guarantee Qualtiy
•Manufactured Under Strict Controls.
•100% Tested (Not Just Batch Tested)
•LINK-PP Is OEM Of TE (Tyco) For 9 Years
•Successful Customer: Texas Instruments Samsung Cisco Siemens And
Intel…
•LINK-PP Is The Preferred Supplier Of TI (Texas Instruments)
•Quality Guarantee:6 Years
Applications For Terminal User
Designed to support applications, such as ADSL modems,
LAN-on-Motherboard. Networking and communication equipments such as HUB, PC card,
Switch, Router, PC Mainboard, SDH, PDH, IP Phone, xDSL modem,Call Center solutions , Complex set top boxes , VOIP gateways
setup,Border Gateway Protocol,fast ethernet switch ...
Competitive Advantage
•19 years production experience,
•2600 staff,
•100% test
•Flexible delivery time
Main Customer
Design for Ti , Intel , Samsung , Fluke , Jabil , Flextronics
,Cypress, Freescale,EKF.......
EMS ApplicationBuilt-in Flexible PCB Assembly; Rigid-Flexible PCB Assembly;
Microelectronic, Flip Chip; Microelectronic, Chip On Board;
Optoelectronic Assembly; RF / Wireless Assembly; Through Hole
Assembly; Surface Mount Assembly; System Assembly; Printed Circuit
Board Assembly
