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LPJ2026KONL RJ45 Modular Jack Through Hole Pin To Pin Cross 0810-1X1T-03

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LINK-PP INT'L TECHNOLOGY CO., LIMITED

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LPJ2026KONL RJ45 Modular Jack Through Hole Pin To Pin Cross 0810-1X1T-03

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Brand Name :	LINK-PP
Certification :	UL,ROHS,Reach,ISO
Model Number :	0810-1X1T-03
Price :	$0.05-$1.28
Delivery Time :	Stock
Payment Terms :	TT,NET30/60/90 Days
Supply Ability :	4200K-PCS/Month

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LPJ2026KONL RJ45 Modular Jack Through Hole Pin To Pin Cross 0810-1X1T-03

LPJ2026KONL RJ45 Modular Jack Through Hole Pin To Pin Cross 0810-1X1T-03

LINK-PP Part Number	LPJ2026KONL	Electrical Specifications @25℃ 1.Turns Ratio(±2%): TX=1CT:1 RX=1CT:1CT 2.Inductance(100KHz/0.1V@8mA):350uH min 3.Insertion Loss: 0.1-100MHz:-1.0dB max 4.Return Loss(dB min): 1-10MHz:-20 10-30MHz:-16 30-60MHz:-12 60-100MHz:-10 5.Crosstalk(dB min): 1-30MHz:-40 30-60MHz:-35 60-100MHz:-30 6.Common Mode Rejiction(dB min): 1-50MHz:-30 50-150MHz:-20 7.Hipot:1500Vrms MIN 8.Operating Temperature: 0℃～70℃.
Designing Model	0810-1X1T-03
Cores per Port	4
LED Option	Orange / Green / Yellow
Latch	TAB UP
Number of Ports	1X1
PCB Mount Angle	SIDE ENTRY
Package Height (mm)	13.25
Package Length (mm)	25.6
Package Width (mm)	16.8
Shield EMI Tabs	WITH
Speed	10/100 BASE-T
Temperature	0 TO 70℃
Turns Ratio RX	1CT:1CT
Turns Ratio TX	1CT:1CT

NOTES:
1.Designed to support application,such as SOHO(ADSL
modems),LAN-on-Motherboard(LOM),hub and Switches.
2.Meets IEEE 802.3 specification
3.Connector Materials:
Housing:Thermoplastic UL94V-0
Contact/Shield: Copper alloy
Shield plating: Nickel
Contact plating: Gold 6 micro-inches min.In contact
area.
4.Wave solder tip temperature: 265℃ Max
Wave solder tip temperature time: 5 Sec Max

Applications:

Used for networking and communication equipments such as HUB, PC card, Switch, Router, PC Mainboard, SDH, PDH, IP Phone, xDSL modem

Main Customer

Design for Ti , Intel , Samsung , Fluke , Jabil , Flextronics ,Cypress, Freescale,EKF.......

EMS Application

Built-in Flexible PCB Assembly; Rigid-Flexible PCB Assembly; Microelectronic, Flip Chip; Microelectronic, Chip On Board; Optoelectronic Assembly; RF / Wireless Assembly; Through Hole Assembly; Surface Mount Assembly; System Assembly; Printed Circuit Board Assembly

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