LPJ1014CNL RJ45 Modular Jack 10/100Mbps Cross 74990110030 No LED
1. P C Mainboard, SDH, PDH, IP Phone, xDSL modem
2. Gigabit Circuit
3.Printed Circuit Board networking and communication equipments
4.Minimum 1500Vrms
5.74990110030
Betriebstemp. / operating temperature: 0°C - + 70°C
Compliant with IEEE 802.3u for 10/100Base-TX-Applications
Description:
LPJ1014CNL RJ45 Modular Jack 10/100Mbps Cross 74990110030 No LED
| Part Number: | LPJ1014CNL |  |
| Cross Compatible; | 74990110030 |
| Manufacturer | LINK-PP |
| Speed: | 1000 Base-T |
| Height(mm) | 13.45 |
| Length(mm) | 25.25 |
| Width(mm) | 16.15 |
| Number of Port: | 1 |
| Turns Ratio (Np:Ns) | 1:1; 1:1 |
TEST NOTES(25±5℃)
1.TR:(100KHZ,100mV);
TX=1CT:1CT ±3% RX=1CT:1CT ±3%P2.LX:(100KHZ,100mV,8mA,DC Bias)
PINS:(P1,P3),(P4,P6)=350uH MIN
3.HIPOT:
PINS(P1,P2,P3)TO (J1,J2)=1500V
PINS(P4,P5,P6)TO (J3,J6)=1500V
4.INSERTION LOSS:
-1.0dB MAX @ 1.0MHz TO 65MHz
5.RETURN LOSS:
-20dB MIN @ 1MHz TO 10MHz
-16dB MIN @ 10MHz TO 30MHz
-12dB MIN @ 30MHz TO 60MHz
-10dB MIN @ 60MHz TO 100MHz
6.CROSS TALK:
-40dB MIN @ 1MHz TO 30MHz
-35dB MIN @ 30MHz TO 60MHz
-30dB MIN @ 60MHz TO 100MHz
7.COMMON TO COMMON MODE REJECTION:
-30dB MIN @1MHz TO 50MHz
-20dB MIN @50MHz TO 150MHz
8.Operating Temperature: 0℃～70℃.
| NOTES: |
| 1.Designed to support application,such as SOHO(ADSL |
| modems),LAN-on-Motherboard(LOM),hub and Switches. |
| 2.Meets IEEE 802.3 specification |
| 3.Connector Materials: |
| Housing: Thermoplastic PBT+30%G.F UL94V-0 |
| Contact: Phosphor Bonze C5210R-EH Thickness=0.35mm |
| Pins: Brass C2680R-H Thickness=0.35mm |
| Shield: SUS 201-1/2H Thickness=0.2mm |
| Contact plating: Gold 6 micro-inches min.In contact area. |
| 4.Wave solder tip temperature: 265℃ Max, 5 Sec Max |
| 5.UL Certification: File Number E484635 |
 |
Applications For Terminal User
Used for networking and communication equipments such as HUB, PC
card, Switch, Router, PC Mainboard, SDH, PDH, IP Phone, xDSL modem,Call Center solutions , Complex set top boxes , VOIP gateways
setup,Border Gateway Protocol,fast ethernet switch ...
Main Customer
Design for Ti , Intel , Samsung , Fluke , Jabil , Flextronics
,Cypress, Freescale,EKF.......
EMS Application
Built-in Flexible PCB Assembly; Rigid-Flexible PCB Assembly;
Microelectronic, Flip Chip; Microelectronic, Chip On Board;
Optoelectronic Assembly; RF / Wireless Assembly; Through Hole
Assembly; Surface Mount Assembly; System Assembly; Printed Circuit
Board Assembly
